UCIe Full Signal Integrity Analysis Flow with Compliance Check for Heterogenous Integration
Year: 2025
Type: article
Abstract: Universal Chiplet Interconnect Express (UCIe) standard is important for the future of advanced packaging and semiconductor system design. This paper explores the trends in the industry and Cadence Design Systems complete analysis solutions with UCIe standard compliance checking and verification. This paper details the analysis solution and design architecture with various testcases from Cadence Design Systems and their customers who continually push the industry standards and challenges the existing analysis capabilities currently available.
Source: IMAPSource Proceedings
DOI: 10.4071/001c.147217
Authors: Shawn Mills, Ken Willis
Institution: Cadence Design Systems (United States)
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: bronze
Funder: U.S. Department of Defense
OpenAlex ID: W4416293990
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