Unravelling the role of interface grain boundary migration in the mechanical performance of solid-state joints
Year: 2025
Type: article
Abstract: Interface Grain Boundary (IGB) migration is a critical phenomenon in various types of solid-state bonding. However, its specific role in determining the mechanical performance of joints remains unclear and debated, as IGB migration often occurs concurrently with other factors such as dynamic recrystallization and oxide evolution. This study aims to isolate and examine the sole influence of IGB migration by controlling other contributing factors. Forge welding and diffusion bonding were employed on high-purity nickel to produce joints with and without IGB migration while ensuring void- and impurity-free grain boundaries at the interface. Microstructural evolution was analysed using different techniques. Additionally, a Crystal Plasticity Finite Element (CPFE) model, integrated with in situ tensile testing, was developed to elucidate the deformation mechanisms near the interface. The results indicate that, in the absence of oxides and voids, IGB migration has a minimal impact on mechanical behaviour. In situ observations and CPFE simulations suggest that stress concentrations at the bond line are mitigated through grain orientation differences and grain reorientation during deformation, reducing the influence of unmigrated boundaries. These findings provide new insights into the fundamental role of IGB on joint performance and offer guidance for the design and manufacturing of next-generation high-performance materials.
Source: Materials & Design
Authors: Yaping Wang, Wei Wang, Jun Jiang
Institution: Imperial College London
Language: English
Subfield: Materials Chemistry
Field: Materials Science
Domain: Physical Sciences
Open Access status: gold
Estimated APC paid: $3,650
Funder: Imperial College London
OpenAlex ID: W4416336632