Silicon nitride photonic platform on glass for scalable, high-density optical redistribution layers in panel-level packaging
Year: 2025
Type: article
Abstract: We present silicon nitride photonics on glass (SING), demonstrated at the wafer-level, establishing its feasibility for high-density optical redistribution layers (RDLs) in panel-level packaging. Demonstrated passive components support 106 Gbps transmission, enabling scalable wafer-level optical interconnects with grating couplers, ring resonators, MMI couplers, MZIs, and stitched waveguides. With a compact 100 µm bend radius, SING enables a 10× higher density than LDW or IOX glass platforms, while remaining compatible with large-panel processing. This positions SING as a promising and scalable solution for next-generation optical RDLs.
Source: Optics Express
DOI: 10.1364/oe.576420
Authors: Taewon Jin, Seokhyeon Yoon, Kyungjin Jo, Heeyun Jung, Seokyoung Shin, Jonggeon Lee, Seungwoo Park, Byungou Lee, Wonmyoung Choi, Minchul Jang, Soo-Yong Jung, Myunghwan Kim, Jong Jin Lee, Younghyun Kim
Language: English
Topic: Photonic and Optical Devices
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: gold
Estimated APC paid: $2,270
OpenAlex ID: W4416378118