Work

Research on Thermal Analysis and Enhanced Heat Dissipation Technology of Fully Enclosed Reinforced Computer

Year: 2025

Type: article

Abstract: Fully enclosed reinforced computers typically need to adapt to harsh environments such as high temperature, humidity, and strong vibration. However, their physical hermeticity leads to a single heat dissipation method, and local overheating caused by high heat flux density components seriously threatens equipment reliability. To address this issue, this study first analyzed its structural characteristics and established a cross-scale simulation model of the chassis and board. Second, aiming at internal heat accumulation and local overheating at high temperatures, the problem was solved by optimizing the layout of components on the motherboard. For thermo-mechanical collaborative optimization of these components, a Pareto-max-min ant algorithm was designed, adopting dynamic state transition, hybrid local search, pheromone update, and Pareto solution set update strategies to obtain the Pareto frontier. The optimal solution was selected via the LINMAP decision method and simulated, and the optimal layout of the fan module was determined. Finally, a prototype was manufactured, and temperature field tests were conducted. Results show that at 25 °C~55 °C, all chips’ temperatures are below the allowable limit, with errors within 10% vs. simulation data, verifying the thermal simulation and design.

Source: Machines

DOI: 10.3390/machines13111067

Authors: Daijiang Zuo, Ruifeng Fan, Jin Huang, Pan Li, Daxi Cheng

Institution: Xidian University

Language: English

Topic: Heat Transfer and Optimization

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: gold

Estimated APC paid: $2,896

Funder: National Natural Science Foundation of China