Effects of simulated inflammation on the encapsulation performance of medical silicone rubber coating for implantable electronic devices
Year: 2025
Type: article
Abstract: This study is the first to investigate the effects of inflammation on the encapsulation performance of silicone rubber. Simulated inflammatory solutions containing H2O2 were prepared for electrochemical measurements and immersion testing of the samples. The hydrogen peroxide (H2O2) released by human inflammatory reactions significantly affects the encapsulation performance of silicone rubber coatings and the corrosion behavior of metal interfaces. Research has shown that H2O2 accelerates the penetration of corrosive media into the coating-metal interface, resulting in a decrease in the encapsulation performance of silicone rubber. Simultaneously, the strong oxidation of H2O2 triggers the degradation of the molecular chain of silicone rubber, which is manifested as the side chain methyl group (-CH3) breaking into methylene and Si-C bonds, and C=O, C-O bonds, and hydroxyl groups are generated, which eventually causes the coating surface to form a mesh crack, accelerating its deterioration. In addition, after H2O2 penetrates the surface of T2 copper, it not only promotes the formation of copper oxides but also significantly enhances the cathodic reaction rate, thereby aggravating copper corrosion. The degree of corrosion increased with increasing H2O2 concentration. This study reveals the coordinated damage mechanism of H2O2 on silicone rubber coating and metal corrosion in the inflammatory microenvironment, providing a theoretical basis for the material optimization of implantable medical electronics.
Language: English
Subfield: Materials Chemistry
Field: Materials Science
Domain: Physical Sciences
Open Access status: gold
Estimated APC paid: $1,640
OpenAlex ID: W4416417449