Review of Alumina‐Based Filler/Epoxy Resin Composites for Thermally Conductive Materials
Year: 2025
Type: article
Source: Polymer Engineering and Science
DOI: 10.1002/pen.70251
Authors: Teng Ding, Wen‐Xuan Ma, Zheng‐Bai Zhao
Institution: Jiangsu University of Science and Technology
Language: English
Subfield: Materials Chemistry
Field: Materials Science
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4416460581