Work

Comparative study on substrate quality of laser slicing and wire saw slicing for SiC wafers

Year: 2025

Type: article

Source: CrystEngComm

DOI: 10.1039/d5ce00994d

Authors: Jianfei Zhang, Yiyang Chen, Linlin Che, Bixue Li, Xing Zhang, Haoyu Fan, Qingyu Li, Jiawei Wang, YuFeng Xue, Yangyang Jia, Qiu Chen, Xiufang Chen, Rongkun Wang

Institutions: Shandong University, State Key Laboratory of Crystal Materials

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, Natural Science Foundation of Shandong Province, Key Technology Research and Development Program of Shandong

Awards: G3507283490, G3813080434, G6204967441, G8320985247

OpenAlex ID: W4416595570

FWCI: 0.911

Cites: 28

Cited by: 4

Related to: