Work

Two copper layer Insulated Metal Substrate PCB potential using Wide-Bandgap semiconductors

Year: 2025

Type: conference-paper

Abstract: This paper evaluates two copper-layer Insulated Metal Substrate (IMS) PCBs for power converters, highlighting reduced parasitic inductance and strong thermal performance. It compares various layouts, considering parasitic capacitance, inductance, thermal resistance, and power density, demonstrating exceptional performance in a 4 kVA half-bridge with a 400 V dc-link design.

Source: HAL (Le Centre pour la Communication Scientifique Directe)

DOI: 10.34746/epe2025-0001

Authors: Capo-Lliteras, Macià, Moreno-Rubio, Pau, Heredero-Peris, Daniel, Montesinos-Miracle, Daniel

Institution: Universitat Politècnica de Catalunya

Language: English

Topic: Advanced DC-DC Converters

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: green

OpenAlex ID: W4416654218

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