Work

Effect of Bismuth Addition to SAC305 on the Microstructure and Mechanical Properties of Solder Joints

Year: 2025

Type: article

Source: Journal of Electronic Packaging

DOI: 10.1115/1.4070515

Authors: Khozima Hamasha, Mohammad M. Hamasha, Sa'd Hamasha

Institutions: Al-Balqa Applied University, Hashemite University, Binghamton University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4416812241

FWCI: 0.924

Cites: 22

Cited by: 4

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