The mechanisms of oxide dissolution evolution and mechanical properties transient liquid phase bonding of SSM 6063 aluminum alloy with zamak 2 binder
Year: 2025
Type: article
Abstract: This study investigates the mechanisms underlying oxide layer evolution and its influence on joint strength during transient liquid phase bonding (TLPB) of SSM 6063 aluminum alloy utilizing Zamak 2 as a binder. The persistent presence of residual oxides in aluminum bonding significantly impedes diffusion kinetics and compromises joint integrity, thereby necessitating a comprehensive investigation into oxide dissolution behavior. This research addresses this gap by systematically evaluating oxide characteristics under varying bonding temperatures (450, 500, and 550°C) and bonding times (60 and 120 minutes), under constant bonding pressure and inert gas conditions. A full factorial design of experiments was implemented, and high-resolution microstructural analysis using SEM-EDS was employed to evaluate oxide distribution and interfacial diffusion. The optimal mechanical strength (23.56 MPa) was obtained at 450°C and 120 min, while oxide formation was minimized. ANOVA revealed that bonding temperature was the most significant factor, followed by bonding time. The regression model explained 89.26% of the total variation. Defects including cracks, porosity, interfacial separation, and oxide barriers were observed and found to significantly impact joint reliability.
Source: Results in Engineering
Authors: D. Maunkhaw, Y. Dunyakul, C. Meengam
Language: English
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: gold
Estimated APC paid: $1,940
OpenAlex ID: W4416818532