Work

Next-Gen Failure Analysis: 3D X-Ray Imaging at 350 nm Meets Laminography

Year: 2025

Type: conference-paper

Source: IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

DOI: 10.1109/ipfa65338.2025.11256626

Authors: S.H. Lau, Jeff Gelb, Sheraz Gul, Doug Rowland, Tianzhu Qin, Chuyuan Zheng, Vikaram Singh, Sylvia Lewis, Wenbing Yun

Institution: Sigray (United States)

Topic: Integrated Circuits and Semiconductor Failure Analysis

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4416874865

FWCI: 2.32

Cites: 8

Cited by: 1

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