Work

Stencil Aperture Area Ratio Extension - Impact of Stencil Technology and Coating

Year: 2017

Type: article

Source: Regional Events

DOI: 10.37665/rejepcd34793

Authors: Benjamin Chang, Tim C.C. Pan, Louis Yang, Srini Aravamudhan, Tzee Sing Mak, Shuh An Moy

Institution: Intel (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4416878805

FWCI:

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