Work

Advanced Capillary Underfill for Flip Chip Attachment

Year: 2002

Type: article

Source: SMTA International

DOI: 10.37665/smvegok53810

Authors: Steve Hackett, Kathleen Gross, William J. Schultz, Wendy Thompson

Institution: 3M (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4416880363

FWCI:

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Related to: 10