Work

In Situ Study of Electromigration in Eutectic Tin-Bismuth Planar Solder Joints

Year: 2024

Type: conference-paper

Source: Pan Pacific Symposium

DOI: 10.37665/ppmukvp76738

Authors: Prabjit Singh, L. Palmer, M. Hamid, T. Wassick, E. Campbell, R. F. Aspandiar, B. Franco, H. Fu, V. Vasudevan, A. Allen, K. Howell, K. Murayama, H. Zhang, A. Lifton, T. Munson, S. Middleton, Richard Coyle, M. Sarangapani

Institutions: IBM (United States), Intel (United States), DELL (United States), Hewlett-Packard (United States), NIHON SUPERIOR CO., LTD. (Japan), Shinko Electric Industries (Japan), Indium Corporation (United States), Foresite (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4416885522

FWCI:

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