Work

Investigation and Simulation of Thermomechanical Stress Induced by Plated Cu Contacts on Si Heterojunction Solar Cells

Year: 2025

Type: article

Source: Progress in Photovoltaics Research and Applications

DOI: 10.1002/pip.70035

Authors: Pei‐Chieh Hsiao, Zhimeng Wang, Jack Colwell, Daniel Chen, Chris Huang, Vince Allen, Alison Lennon, Renate Egan

Institution: UNSW Sydney

Language: English

Topic: Silicon and Solar Cell Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Affordable and clean energy

Open Access status: closed

Funders: Australian Centre for Advanced Photovoltaics, Australian Renewable Energy Agency, New South Wales Government

OpenAlex ID: W4416894191

FWCI:

Cites: 51

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