Electroactive hydrogel bone adhesives: From intelligent design to biomedical applications
Year: 2025
Type: article
Abstract: In recent years, conductive adhesive bone hydrogels have garnered significant attention in bone repair applications due to their exceptional wet adhesion, multifunctionality, and ability to couple with endogenous electric fields. This paper provides a comprehensive review of the latest advancements in conductive bone adhesives research. The review first discusses design strategies for conductive, hemostatic, and adhesive hydrogels, and also introduces the role of artificial intelligence (AI) in assisting the design of conductive bone adhesives. Subsequently, the paper delves into the applications of conductive adhesive hydrogels in cartilage repair, bone repair, vascular regeneration, and neural repair. Additionally, it summarizes the current challenges in the development and use of conductive bone adhesives, as well as the promotional effects of AI on the design of electroactive bone adhesives. Finally, the paper offers an insightful and forward-looking perspective aimed at inspiring future innovations in this promising field.
Source: Advanced Orthopaedics
Authors: Yujia Zheng, Shengxi Jiang, Peiji Yang, Qiaoqi Zheng, Huabin Liu, Ying Chen, Zhouhao Wu, Xiong Lu, Chaoming Xie
Institution: Southwest Jiaotong University
Language: English
Subfield: Biomedical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: hybrid
Estimated APC paid:
OpenAlex ID: W4416920890