Work

Reliability Issues of Thick-Film Resistors in Embedded Piezoelectric Smart Aggregates for Strain Monitoring

Year: 2025

Type: conference-paper

Source: IEEE International Conference on Microelectronics (MIEL)

DOI: 10.1109/miel66332.2025.11261034

Authors: Ivanka Stanimirović, Pavle Stanimirović, Zdravko Stanimirović

Institution: University of Belgrade

Language: English

Topic: Smart Materials for Construction

Subfield: Pollution

Field: Environmental Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4416923578

FWCI:

Cites: 11

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