Work

Atomistic Insights into Cu/Amorphous-Ta x N Interfacial Adhesion via Machine Learning Interatomic Potentials: Effects of Stoichiometry and Interface Construction

Year: 2025

Type: article

Source: ACS Applied Electronic Materials

DOI: 10.1021/acsaelm.5c02157

Authors: Jeong Min Choi, Jaehoon Kim, Ji-Hwan Lee, Won-Joon Son, Seungwu Han

Institutions: Seoul National University, Institute of Advanced Materials, Samsung Electronics (South Korea), Korea Institute for Advanced Study

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

Funders: Korea Institute of Science and Technology Information, National Research Foundation of Korea, Samsung, Korea Institute for Advanced Study

Awards: G4276937960, G8470921070, G979923898

OpenAlex ID: W4416935550

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Cites: 69

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