Work

A study on interfacial structure design and thermal conductivity optimization of diamond/copper composites

Year: 2025

Type: article

Abstract: By combining first-principles calculations and COMSOL simulations, this work obtained results that closely match the experimental findings.

Source: Materials Advances

DOI: 10.1039/d5ma01082a

Authors: Dandan Li, Jian Wang, Yunzhen Jiang, Zhanghui Liu, Guojie Huang, Jinsong Feng, Bo Peng, Bing Wang, Ruzhi Wang

Institutions: Beijing University of Technology, China Nonferrous Metal Mining (China)

Language: English

Topic: Thermal properties of materials

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: gold

Estimated APC paid: $1,962

OpenAlex ID: W4417014458

FWCI: 0.417

Cites: 28

Cited by: 2

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