Bidirectional interfacial interactions and Cu x S bond formation enabled by a thiourea-crosslinked binder for high-performance micro-SiO x anodes
Year: 2025
Type: article
Source: Journal of Materials Chemistry A
DOI: 10.1039/d5ta08649c
Authors: Jong Hyeok Han, Seo Jin Yeon, Chaeyoung Kim, Senthil Kannan, Taeeun Yim, Tae-Hyun Kim
Institution: Incheon National University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4417015258