Work

Label-Efficient PCB Defect Detection with an ECA–DCN-Lite–BiFPN–CARAFE-Enhanced YOLOv5 and Single-Stage Semi-Supervision

Year: 2025

Type: article

Abstract: Printed circuit board (PCB) defect detection is critical to manufacturing quality, yet tiny, low-contrast defects and limited annotations challenge conventional systems. This study develops an ECA-DCN-lite-BiFPN-CARAFE-enhanced YOLOv5 detector by modifying You Only Look Once (YOLO) version 5 (YOLOv5) with Efficient Channel Attention (ECA) for channel re-weighting, a lightweight Deformable Convolution (DCN-lite) for geometric adaptability, a Bi-Directional Feature Pyramid Network (BiFPN) for multi-scale fusion, and Content-Aware ReAssembly of FEatures (CARAFE) for content-aware upsampling. A single-cycle semi-supervised training pipeline is further introduced: a detector trained on labeled images generates high-confidence pseudo-labels for unlabeled data, and the combined set is used for retraining without ratio heuristics. Evaluated on PKU-PCB under label-scarce regimes, the full model improves supervised mean Average Precision at an Intersection-over-Union threshold of 0.5 ([email protected]) from 0.870 (baseline) to 0.910, and reaches 0.943 [email protected] with semi-supervision, with consistent class-wise gains and faster convergence. Ablation experiments validate the contribution of each module and identify robust pseudo-label thresholds, while comparisons with recent YOLO variants show favorable accuracy-efficiency trade-offs. These findings indicate that the proposed design delivers accurate, label-efficient PCB inspection suitable for Automated Optical Inspection (AOI) in production environments. This work supports SDG 9 by enhancing intelligent manufacturing systems through reliable, high-precision AI-driven PCB inspection.

Source: Sensors

DOI: 10.3390/s25237283

Authors: Zhenxia Wang, Nurulazlina Ramli, Tzer Hwai Gilbert Thio

Institutions: Hebei Vocational University of Technology and Engineering, SEGi University

Language: English

Topic: Industrial Vision Systems and Defect Detection

Subfield: Industrial and Manufacturing Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: gold

Estimated APC paid: $3,137