Strategies for Enhancing SiO 2 Chemical‐Mechanical Polishing (CMP): Functional Nanoparticle Abrasive Design and Integration
Year: 2025
Type: article
Source: Chemistry - A European Journal
Authors: Hyeonseok Lee, Gyuhyeon Kim, Wooseok Jeong, Yeongbin Lee, Heesoo Jeong, Yujeong Ahn, Chanbi Kim, Don‐Hyung Ha
Institution: Chung-Ang University
Language: English
Subfield: Biomedical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Awards: G1700731298, G2769991864
OpenAlex ID: W4417070987