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Zinc Plating on Copper Proceeds via Breakdown of a Capacitive Electric Double Layer

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Year: 2025
Type: article
Source: Journal of the American Chemical Society
DOI: 10.1021/jacs.5c17948
Authors: Haoxiang Sun, Shulin Ding, Jinkai Zhang, Yujie Chen, Xinyao Wu, Zhao Zhang, Tong Zhou, Zhenhua Yan, Kai Zhang, Qing Zhao, Wei Xie, Ke Yang, Guang Feng, Eiichi Nakamura, Jun Chen, Wei Zhang
Institutions: Nankai University, State Key Laboratory of Coal Combustion, Huazhong University of Science and Technology, The University of Tokyo
Language: English

Topic: Electrodeposition and Electroless Coatings
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, Japan Society for the Promotion of Science, National Key Research and Development Program of China
Awards: G1203620298, G1353056023, G5271055667, G5665548195, G8913325375
OpenAlex ID: W4417162852
FWCI: 1.155
Cites: 36
Cited by: 5
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