Work

Hydrogen‐Bond Assembly Energetic Films with Ultra‐Flexibility and Reactivity for Advanced Transient Microchips

Year: 2025

Type: article

Source: Advanced Functional Materials

DOI: 10.1002/adfm.202525672

Authors: Jian Wang, Jian Wang, Xinxing Zeng, Fude Nie, Renming Pan, Jie Chen, Yaofeng Mao, Haifu Wang, Xingquan Zhang, Jun Wang, Jun Wang

Institutions: Beijing Institute of Technology, China Academy of Engineering Physics, Nanjing University of Science and Technology, State Key Laboratory of Explosion Science and Safety Protection, Southwest University of Science and Technology

Language: English

Topic: Energetic Materials and Combustion

Subfield: Mechanics of Materials

Field: Engineering

Domain: Physical Sciences

SDG: Affordable and clean energy

Open Access status: closed

Funder: National Natural Science Foundation of China

Awards: G1143017143, G7494904694

OpenAlex ID: W4417184992

FWCI: 0.966

Cites: 46

Cited by: 3

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