Cu Filling into Seed and Seedless Layered Through-Silicon-Via and Hybrid Bonding for High-Density Semiconductor Packaging
Year: 2025
Type: article
Abstract: 서 론실리콘 관통 전극(through-silicon-via, TSV) 패키징 분야 가 AI 반도체와 고대역폭 메모리(high bandwidth memory, HBM) 수요 확대에
Authors: Chae Yeon Lim, Shin Hui Seon, Hyun-Sik Kim, Jae Pil Jung
Institution: University of Seoul
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: hybrid
OpenAlex ID: W4417345687