Photonic chip packaging for extreme environments
Year: 2025
Type: article
Source: Photonics Research
DOI: 10.1364/prj.565679
Authors: Sarah M. Robinson, CH. S. S. Pavan Kumar, Ashutosh S. Rao, Daniel S. Barker, Fred B. Bateman, Kevin O. Douglass, Thinh Q. Bui, Glenn E. Holland, Daron A. Westly, Nikolai N. Klimov
Language: English
Topic: Photonic and Optical Devices
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4417430836