Work

Sustainable Cooling of Application-Specific Integrated Circuit Chips

Year: 2025

Type: article

Source: Journal of Thermophysics and Heat Transfer

DOI: 10.2514/1.t7310

Authors: Chia-Hsin Hsieh, Ming-Hsien Hsueh, Chao-Jung Lai, Tao-Hsing Chen, Yen-Yu Chen

Institutions: National Kaohsiung University of Science and Technology, National Pingtung University of Science and Technology, National Chung Hsing University

Language: English

Topic: Heat Transfer and Optimization

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Affordable and clean energy, Industry, innovation and infrastructure

Open Access status: closed

Funder: National Science and Technology Council

Awards: G1564315732, G4642285489, G6337034713

OpenAlex ID: W4417434156

FWCI:

Cites: 20

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