AI Market Today and Beyond: Transforming the Future of Advanced Packaging
Year: 2025
Type: article
Source: IMAPSource Proceedings
DOI: 10.4071/001c.153866
Author: Gabriela Pereira
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4417440895
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