Research on reliability of straight pin solder joints in CFP package with different process parameters
Year: 2025
Type: conference-paper
Source: IET conference proceedings.
Authors: Hang Ji, Kunlun Li, Kerun Men, Kaixuan Ai, Yuxing Zhang, Zhigang He, Jian Wang
Institution: China Academy of Engineering Physics
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4417455285
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