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An integrated platform for dynamic reliability and risk applications

Year: 2025

Type: conference-paper

Source: IET conference proceedings.

DOI: 10.1049/icp.2025.3430

Authors: Jun Yang, Xiya Zhu, Bohao Tian, Chuanlong Jiang, Chenyu Jiang, Zhanyu He

Institutions: South China University of Technology, China Electronic Product Reliability and Environmental Test Institute

Language: English

Topic: Reliability and Maintenance Optimization

Subfield: Safety, Risk, Reliability and Quality

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4417455467

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