Failure mechanism evolution of bond wires and solder layer under various thermal coupling effects
Year: 2025
Type: conference-paper
Source: IET conference proceedings.
Authors: Jieyu He, Ken Chen, Yuanbin Long, Zhiliang Xu, Xinglai Ge
Institution: Southwest Jiaotong University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4417455483
FWCI:
Cites:
Cited by:
Related to: