Work

Study on the factors of substrates shedding in T/R module and failure cases analysis

Year: 2025

Type: conference-paper

Source: IET conference proceedings.

DOI: 10.1049/icp.2025.3721

Authors: Zihao Liang, Lili Ma, Xiao He

Institution: China Electronic Product Reliability and Environmental Test Institute

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4417455495

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