Work

Scalable SiO 2 /Epoxy Dielectric Films for High‐Yield and Fine‐Line Substrate Fabrication via Copper Tooth Transfer Printing

Year: 2025

Type: article

Source: Advanced Engineering Materials

DOI: 10.1002/adem.202502745

Authors: Suibin Luo, Yuying Sui, Junyi Yu, Chunbo Gao, Chuanxi Zhu, Pengpeng Xu, Wen‐Di Li, Xun Wei, Shuhui Yu

Institutions: Guangzhou University, Southeast University, Chinese Academy of Sciences, Shenzhen Institutes of Advanced Technology, University of Hong Kong

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: University of Hong Kong

Award: G4311926332

OpenAlex ID: W4417539238

FWCI: 0.462

Cites: 23

Cited by: 2

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