Work

Modeling Permittivity Measurements of Thin Film Materials Versus Film Thickness

Year: 2024

Type: conference-paper

Source: IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP)

DOI: 10.1109/ceidp61745.2024.10907660

Authors: JR Dennison, Cameron Eggleston, Donna Metcalf

Institution: Utah State University

Language: English

Topic: Microwave and Dielectric Measurement Techniques

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W6903391531

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Cites: 5

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