Integrating Electronics and Communication Engineering in Advancing Artificial Intelligence: Hardware, Connectivity, and Innovation Synergies- A Review
Year: 2025
Type: article
Abstract: This paper explores the synergies between ECE and AI, highlighting how advancements in semiconductor technology, sensor systems, and communication networks have enabled the growth of AI applications. Electronics pro- vide the computational backbone for AI through specialized processors such as GPUs, TPUs, and neuromorphic chips, while sensors and IoT devices facilitate real-time data acquisition essential for AI training and inference. Concurrently, communication systems, including 5G and edge computing, ensure efficient data transmission and low-latency processing for AI driven applications such as autonomous vehicles, smart cities, and healthcare monitoring. The integration of electronics and communication with AI also drives innovations in machine learning acceleration, energy-efficient computing, and real-time analytics. This paper concludes by discussing future opportunities, such as the role of quantum computing and next-generation communication protocols, in shaping the evolution of AI technologies. The findings underscore the critical importance of interdisciplinary approaches in fostering AI’s continued advancement.
Authors: Shaik Abdul Khadar, Md Mujeeb, Md Altafuddin, Muskan Tahura
Language: English
Subfield: Artificial Intelligence
Field: Computer Science
Domain: Physical Sciences
Open Access status: green
OpenAlex ID: W6930695035
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