ZettaLith: WSSCB manufacturing process
Year: 2025
Type: article
Abstract: Detailed manufacturing process for the wafer-scale silicon circuit board (WSSCB) used in ZettaLith and ExaLith
Author: Silverbrook, Kia
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: green
OpenAlex ID: W6930905898
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