Work

Optimization of a High Power-Density Inverter for Automotive Applications by Means of Top-Side Cooled Power Devices

Year: 2025

Type: conference-paper

Abstract: The aim of this paper is to discuss the thermal modeling and simulations performed in the design and the development of a full electro-mechanical leveling system based on wide band-gap power devices operating at high voltage based on top-side cooled transistors. Due to the installation location of the electronic control unit (ECU), only air cooling is suitable. For this reason, a good thermal modeling is crucial to allow correct sizing of the whole power stage. The usage of power transistors installed into top-side cooled package eased the task, but the thermal behavior of the whole system has to be verified. The document describes how the thermal models have been done and simulated at two different levels: first, focusing on the chip to evaluate the performance of the package available on the market; second, focusing on the whole ECU for estimating the capabilities of the unit under operating conditions.

Source: Zenodo (CERN European Organization for Nuclear Research)

DOI: 10.5281/zenodo.16835555

Authors: Tranchero, Maurizio, Giraudi, Lorenzo, Santero, Paolo

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Affordable and clean energy, Industry, innovation and infrastructure

Open Access status: green

Funder: European Commission

Award: High Performance Power Electronics Integrations