Work

Localized Embedded Passive Module Layer for High-Performance PCB and Package Designs

Year: 2025

Type: article

Abstract: This proposal introduces a Localized Embedded Passive ModuleLayer (LEPML) concept, integrating capacitors, resistors, andoptionally inductors directly into targeted zones of a PCB or packagesubstrate.

Source: Zenodo (CERN European Organization for Nuclear Research)

DOI: 10.5281/zenodo.16777234

Author: no one wants the idea, taiwan

Language: English

Topic: Electromagnetic Compatibility and Noise Suppression

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: green

OpenAlex ID: W6931188743

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