Year: 2024
Type: article
Abstract: \nThis paper investigates the challenges of minimizing wafer deformation during laser polishing of fused silica. The focus is on the Twyman effect, which causes unwanted curvature in thin plates. Strategies to reduce stress-induced deformation are proposed to enhance the reproducibility of the laser polishing process.\n
Authors: Sven Lämmler, David Bischof, Oliver Fähnle
Institution: OST - Ostschweizer Fachhochschule
Language: English
Subfield: Biomedical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: green
OpenAlex ID: W6959865478
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