Solder Pastes in Shingled Modules
Year: 2024
Type: conference-paper
Abstract: In this work, we show that solder pastes can be used in the shingled module concept and exhibit excellent durability. We further explore the use of solder pastes for shingled module applications with particular attention focused on reducing the amount of solder paste required per interconnection, the compatibility with relevant industrial module assembly processes, extending the mechanical integrity of connections through the use of non-conductive adhesive, and on the performance and durability of shingled modules made using optimized application of this material.
Source: EU PVSEC
Authors: Wienands, Karl, Devoto, Ignacia, Kopp, Nils, Hallensleben, Carina, Kizukuri, Rihoko, Helbig, Matthias, Kurtovic, Enita, Halm, Andreas, Tune, Daniel
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: green
OpenAlex ID: W6966733934
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