Work

Exploring the application of shellac as an encapsulant for printed electronic devices

Year: 2025

Type: conference-paper

Source: Scholarship at UWindsor (University of Windsor)

Authors: Blackburn, Madysyn, Hussein, Rahaf, D'amaral, Gloria, Renaud, Lauren, Addison, Emily, Jessop, Hannah, Bannard, Greg, Ng, Eliza

Language: English

Topic: Nanomaterials and Printing Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Responsible consumption and production

Open Access status: closed

OpenAlex ID: W6981765514

FWCI:

Cites:

Cited by:

Related to: