Work

CB-35 Low-Cost Reflow Soldering: Repurposing a Toaster Oven for Reflow Soldering

Year: 2025

Type: conference-paper

Source: Scholar Commons (University of South Carolina)

Authors: Mullikin, Benjamin C, Ojo, Stephen A

Institution: Anderson University - South Carolina

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W7017948285

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