Work

Multiscale thermal and thermomechanical analysis of a SiP using Fan Out Wafer LevelPackaging (FO-WLP) technology

Year: 2025

Type: conference-paper

Source: HAL (Le Centre pour la Communication Scientifique Directe)

Authors: Arnaud Kakou, N’doua Luc, Sommet, Raphaël, Bortolussi, Vincent, Jakani, Anass, Nallatamby, Jean-Christophe

Institutions: XLIM, Université de Limoges, United Monolithic Semiconductor (France)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W7030472470

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