Thermal analysis of a FO-WLP SiP with Integrated GaN Power Amplifier and GaAs LowNoise Amplifier
Year: 2025
Type: conference-paper
Authors: Jakani, Anass, Jacquet, Jean-Claude, Bouslama, Mohamed, Bortolussi, Vincent, Sommet, Raphaël, Lambert, Benoît, Gauthier, Gildas
Institutions: XLIM, Université de Limoges
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W7034583387
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