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Towards 200 mm 2D materials transfer: Wafer scale characterizations during 2D materials transfer onto temporary substrate.

Year: 2024

Type: conference-paper

Source: HAL (Le Centre pour la Communication Scientifique Directe)

Authors: Brunet, Paul, Meyer, Thibaut, Rolland, Emmanuel, Dey, Benjamin, Cadot, Stephane, Pinchart, Camille, Fournel, Frank, Le Van-Jodin, Lucie

Language: English

Topic: 2D Materials and Applications

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W7043772910

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