Work

A High-Density 3-D Capacitor Using Through Glass Via Structure

Year: 2025

Type: article

Source: IEEE Electron Device Letters

DOI: 10.1109/led.2025.3599178

Authors: Su-Geun Kim, Sung-Chai Yoo, Jeongwon Oh, Byung-Wook Min, Jong-Min Yook

Institutions: Korea Electronics Technology Institute, Yonsei University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: National Research Foundation of Korea, Ministry of Science and ICT, South Korea

OpenAlex ID: W7076053372

FWCI: 0.452

Cites: 14

Cited by: 2

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