Utilizing an Innovative Approach: The Thin Lens Chip Layers (TLCL) Concept
Year: 2025
Type: article
Abstract: In our research study, we are pleased to present an innovative methodology for the fabrication of memory chips, utilizing our innovative approach Thin Lens Chip Layers (TLCL) concept. This innovative novel approach is engineered to enhance the overall performance metrics, energy efficiency, and reliability of memory devices. By leveraging advanced layer integration techniques and precise optical engineering principles, the TLCL framework aims to address current limitations in memory chip manufacturing, thereby promoting scalable and robust memory solutions suitable for next-generation electronic systems.
Author: Lie Chun Pong
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: green
OpenAlex ID: W7077919424
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