Diamond-MolyCopper Bonding via Molybdenum Interface for Enhanced Thermal Management in Microelectronics
Year: 2025
Type: article
Source: Lincoln (University of Nebraska)
Author: Carlson, Brooke B.
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W7078799094
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