Work

A Joint Data Transmission Scheme With Improved CAC for 3D-SICs Based on Multiple TSV Subarrays

Year: 2025

Type: article

Source: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

DOI: 10.1109/tcad.2025.3607139

Authors: Huan Yang, Xiaole Cui, Chen Wei, Juncheng Pu, Zhaohong Lin, Xing Zhang

Institution: Peking University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: National Natural Science Foundation of China

Award: G4484392832

OpenAlex ID: W7080294649

FWCI:

Cites: 26

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