Using thermal modelling to design food packaging that can withstand extreme temperatures in cold chain.
Year: 2025
Type: conference-paper
Abstract: International audience
Authors: CAVELIER C., HOANG H. M., NDOYE F. T., LEDUCQ D., ALVAREZ G.
Language: English
Subfield: Computational Mechanics
Field: Engineering
Domain: Physical Sciences
Open Access status: green
Funder: Agence Nationale de la Recherche
OpenAlex ID: W7081525166
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